Sensor chip stack and method of producing a sensor chip stack

• Main Authors: FITZI ANDREAS, PARTEDER GEORG, KRAFT JOCHEN, TROXLER THOMAS, SCHRANK FRANZ
• Format: Patent
• Language: Chinese; English
• Published: 12.01.2018
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The sensor chip stack comprises a sensor substrate (1) of a semiconductor material including a sensor, a chip (10) fastened to the sensor substrate, the chip including an integrated circuit (11), electric interconnections (4) between the sensor substrate and the chip, electric terminals (19) of the chip, the chip being arranged between the electric terminals and the sensor substrate, and a moldingmaterial (13) arranged adjacent to the chip, the electric terminals of the chip being free from the molding material. 种传感器芯片堆叠，包括：半导体材料的传感器基板(1)，其包括传感器；芯片(10)，其被紧固到传感器基板，该芯片包括集成电路(11)；传感器基板和芯片之间的电互联(4)；芯片的电端子(19)，芯片被布置在电端子和传感器基板之间；以及模制材料(13)，其被布置成与芯片相邻，芯片的电端子没有模制材料。