MOS capacitor, semiconductor fabrication method and mos capacitor circuit
A metal-oxide-semiconductor (MOS) capacitor is disclosed. The MOS capacitor includes a front-end-of-the-line (FEOL) field effect transistor (FET), and a plurality of middle-end-of-the-line (MEOL) conductive structures. The FEOL FET includes a source region and a drain region positioned in a semicond...
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Main Authors | , , |
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Format | Patent |
Language | Chinese English |
Published |
09.01.2018
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Subjects | |
Online Access | Get full text |
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Summary: | A metal-oxide-semiconductor (MOS) capacitor is disclosed. The MOS capacitor includes a front-end-of-the-line (FEOL) field effect transistor (FET), and a plurality of middle-end-of-the-line (MEOL) conductive structures. The FEOL FET includes a source region and a drain region positioned in a semiconductor substrate, and a gate over the semiconductor substrate. The plurality of MEOL conductive structures is disposed on a top surface of the gate. At least one of the MEOL conductive structures is electrically disconnected from a back-end-of-the-line (BEOL) metal layer. A semiconductor fabricationmethod and a MOS capacitor circuit are also disclosed.
本发明实施例公开了种金属氧化物半导体(MOS)电容器。MOS电容器包括前段制程(FEOL)场效应晶体管(FET)和多个中间段制程(MEOL)导电结构。FEOL FET包括设置在半导体衬底中的源极区和漏极区和位于半导体结构上方的栅极。在栅极的顶面上设置多个MEOL导电结构。MEOL导电结构的至少个与后端制程(BEOL)金属层电断开。本发明也公开了半导体制造方法和MOS电容器电路。本发明实施例涉及MOS电容器、半导体制造方法以及MOS电容器电路。 |
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Bibliography: | Application Number: CN201611246207 |