Method for manufacturing solder electrode and intended use thereof

• Main Authors: YAMAGUCHI YOSHIKAZU, HASEGAWA KOUICHI, MUKAWA JUN, TAKAHASHI SEIICHIROU, KUSUMOTO SHIROU
• Format: Patent
• Language: Chinese; English
• Published: 02.01.2018
• Subjects: APPARATUS SPECIALLY ADAPTED THEREFOR; BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CINEMATOGRAPHY; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROGRAPHY; HOLOGRAPHY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; MATERIALS THEREFOR; ORIGINALS THEREFOR; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

The present invention is a method for manufacturing a solder electrode, the method comprising a step (1) in which a coating film of a light-sensitive resin composition is formed on a substrate that has an electrode pad, a step (2) in which the coating film is selectively exposed and developed to form a resist having an opening section in a region corresponding to the electrode pad, and a step (3)in which the opening section is filled with molten solder, wherein the light-sensitive resin composition contains at least a benzoxazole precursor. This method for manufacturing a solder electrode such as an IMS method makes it possible to prevent cracking on the resist surface even if the resist is subjected to high heat during solder filling and to improve solder filling performance, and as a result thereof, a solder electrode that is suited to the purpose thereof can be appropriately manufactured. 本发明是种焊料电极的制造方法，其包括：步骤(1)，在具有电极垫的基板上形成感光性树脂组合物的涂膜；步骤(2)，通过将所述涂膜选择性曝光，进而进行显影，而在与电极垫对应的区域形成具有开口部的抗蚀剂；步骤(3)，在所述开口部填充熔融焊料；且所