Producing wafer level packaging using leadframe strip and related device

• Main Authors: KIBBY HORSFORD, RICHARD S. GRAF, SUDEEP MANDAL
• Format: Patent
• Language: Chinese; English
• Published: 15.12.2017
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The invention relates to a producing wafer level packaging using leadframe strip and related device. The method for producing wafer level packaging using an embedded leadframe strip and the resulting device are provided. Embodiments include placing dies into a mold with an active side of each die facing a surface of the mold; placing a leadframe strip on the mold, wherein the leadframe strip includes etched and half etched portions positioned between each die; placing a mold cover over the mold and dies; and adding mold compound in spaces between the dies and mold cover. 本发明涉及使用导线架条制造晶片级封装及相关装置，提供种使用嵌埋式导线架条制造晶片级封装的方法及其产生的装置。具体实施例包括将晶粒置放到模具内并使各晶粒的主动侧面向该模具的表面；将导线架条置放于该模具上，其中该导线架条包括安置于各晶粒间的已蚀刻部分及半蚀刻部分；将模具盖置放于该模具及晶粒上方；以及在介于该晶粒与模具盖之间的空间中添加成型化合物。