Method for board splitting, target hole drilling and edge cutting for circuit board

• Main Author: LYU SHUMIN
• Format: Patent
• Language: Chinese; English
• Published: 08.12.2017
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

The invention relates to a method for board splitting, target hole drilling and edge cutting for a circuit board. The method mainly comprises the steps of multi-sheet board laminating, dimension acquiring, detecting and positioning, and board cutting and splitting; and in addition, working procedures of target hole drilling and edge grinding are performed by target position identification according to needs in sequence, and finally the process of board splitting, target hole drilling and edge grinding is completed. The method is applied to a high-density circuit board lamination process; and multiple circuit boards with relatively small areas are arranged on a circuit board with a relatively large area to perform board splitting and cutting, and finally, target hole drilling and edge grinding are performed to accomplish the needed working procedures completely, so that full automation and accuracy of the process are improved effectively, and the method has industrial utility value. 本发明涉及种电路板分板钻靶及磨边方法，其步骤主要包括多