Series packaged semiconductor device and lead wire frame thereof

• Main Authors: CHEN WENBIN, LUO XIAOCHUN
• Format: Patent
• Language: Chinese; English
• Published: 08.12.2017
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The present invention relates to a series packaged semiconductor device and a lead wire frame thereof. The lead wire frame is a conductor material and comprises a chip island used for setting chips, the chip island comprises a first island and a second island isolated with the first island, and the first and second islands are equipped with two chips respectively. The second island comprises a lead wire connection area, and is used to connect the chip arranged on the first island via a lead wire to be in series connection with the chip arranged on the second island. The lead wire frame also comprises a second pin and a first pin electrically connected with the first island, one of the first pin and the second pin is used as an input end after the series connection, and the other one is used as an output end after the series connection. According to the present invention, the series packaging of the two chips is realized by the simple structure and the low cost, and the implementation performance is good. 本发明涉