Semiconductor device package and methods of manufacture thereof

• Main Author: YAP WENG FOONG
• Format: Patent
• Language: Chinese; English
• Published: 08.12.2017
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

A semiconductor device package and method of manufacturing is provided. An interconnect pre-assembly includes a first frame having a plurality of first signal conduits affixed to a second frame having a plurality of second signal conduits embedded in a second substrate forming an electrical coupling between one or more first signal conduits and one or more of the second signal conduits. One or more conductive balls are connected to the one or more second signal conduits. The interconnect pre-assembly is placed over a semiconductor die, having at least one of the first conductive balls disposed over the semiconductor die. An encapsulant encapsulates the interconnect pre-assembly, the semiconductor die, and the one or more conductive balls, such that a portion of the one or more first conductive balls is exposed at a top surface of the encapsulant. 本发明提供种半导体装置封装和其制造方法。互连预装配件包括具有多个第信号通道的第框架，所述第框架粘附到具有嵌入第二衬底中的多个第二信号通道的第二框架，从而在个或多个第信号通道与所述第二信号通道中的个或多个第二信号通道之间形成电耦合。个或多个导电球连接到所述个或多个第二信号通道。所述互连预装配件放置在半导体管芯上方，从而使所述第导电