Gas flow for condensation reduction with a substrate processing chuck

• Main Authors: WILLWERTH MICHAEL D, KIM HUN SANG
• Format: Patent
• Language: Chinese; English
• Published: 01.12.2017
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

A gas flow is described to reduce condensation with a substrate processing chuck. In one example, a workpiece holder in the chamber having a puck to carry the workpiece for fabrication processes, a top plate thermally coupled to the puck, a cooling plate fastened to and thermally coupled to the top plate, the cooling plate having a cooling channel to carry a heat transfer fluid to transfer heat from the cooling plate, a base plate fastened to the cooling plate opposite the puck, and a dry gas inlet of the base plate to supply a dry gas under pressure to a space between the base plate and the cooling plate to drive ambient air from between the base plate and the cooling plate. 描述种气流，用于减少基板处理夹盘的冷凝。在示例中，该腔室中的工件支架具有定位盘、上板、冷却板、底板、以及该底板的干燥气体入口，该定位盘用于携载该工件以进行制造处理，该上板热耦接至该定位盘，该冷却板紧固至并热耦接至该上板，该冷却板具有冷却通道以携载热传递流体从而传递来自该冷却板的热，该底板与该定位盘相对地紧固至该冷却板，而该底板的干燥气体入口用以在压力下供应干燥气体至该底板与该冷却板之间的空间从而驱动来自该底板与该冷却板之间的环境空气。