Heat dissipation structure of high-power LED lamp

• Main Authors: ZOU JIAXIANG, XUE XIAOYANG, ZHOU GANGLONG, SONG FEIGANG, WU GUOMING, HE JINFENG
• Format: Patent
• Language: Chinese; English
• Published: 24.11.2017
• Subjects: BLASTING; FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMSTHEREOF; HEATING; INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21Sand F21V, RELATING TO THEFORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THELIGHT EMITTED; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATINGELEMENTS; LIGHTING; MECHANICAL ENGINEERING; NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHERARTICLES, NOT OTHERWISE PROVIDED FOR; WEAPONS

The invention relates to a heat dissipation structure of a high-power LED lamp. The heat dissipation structure comprises a radiator, a power supply bin and a baffle arranged in the radiator and the power supply bin. The radiator is of an integrated die-casting aluminum structure and comprises a round base and fins annularly distributed on the outer edge of the surface of the base. The fins are evenly distributed on the base at intervals, the outer sides of the fins are in arc shapes, the inner sides of the fins are inclined faces, the included angles between the inclined faces and the base are obtuse angles, and the inclined faces extend to the center of the base. The power supply bin is in a horn shape, the bottom of the power supply bin is attached to the top of the radiator, a plurality of evenly distributed air guiding openings are formed in the position, close to the radiator, of the power supply bin and located below the top of the baffle, and the air guiding openings are distributed corresponding to th