Copper/tin nano composite powder active solder and preparation method thereof

• Main Authors: KOU LULU, XIAO YU, ZHAO XINGKE, XU SHOUKAI
• Format: Patent
• Language: Chinese; English
• Published: 17.11.2017
• Subjects: CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM

The invention discloses copper/tin nano composite powder active solder and a preparation method thereof, and belongs to the technical field of electronic packaging. The copper/tin nano composite powder active solder is formed by mechanical activation compounding of copper and tin, and the molar rati...