Copper/tin nano composite powder active solder and preparation method thereof

• Main Authors: KOU LULU, XIAO YU, ZHAO XINGKE, XU SHOUKAI
• Format: Patent
• Language: Chinese; English
• Published: 17.11.2017
• Subjects: CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM

The invention discloses copper/tin nano composite powder active solder and a preparation method thereof, and belongs to the technical field of electronic packaging. The copper/tin nano composite powder active solder is formed by mechanical activation compounding of copper and tin, and the molar ratio of the copper to the tin is 1:1-3:1. The particle size of composite powder is tens of to hundreds of microns, and the composite powder is formed by alternately arraying the copper and the tin in a layering mode. The thickness of each layer is tens of to thousands of nanometers. A small amount of copper and tin intermetallic compound can be formed in particles of the composite powder. The mechanical activation preparation method of the composite powder active solder refers to high energy ball milling. According to the high energy ball milling, pure copper powder and pure tin powder are used as raw materials, the molar ratio of the copper powder raw material to the tin powder raw material is 1:1-3:1, vacuum or atmo