Plasma improved method for preparing sub-nanometer spherical silica power

The invention discloses a plasma improved method for preparing sub-nanometer spherical silica power, which comprises the steps of silica powder grinding, sieving, pre-reaction, reaction and cooling, wherein the silica powder grinding is operated by grinding fluid and a grinding disc; the silica powd...

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Bibliographic Details
Main Author TANG JIANJIANG
Format Patent
LanguageChinese
English
Published 24.10.2017
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Summary:The invention discloses a plasma improved method for preparing sub-nanometer spherical silica power, which comprises the steps of silica powder grinding, sieving, pre-reaction, reaction and cooling, wherein the silica powder grinding is operated by grinding fluid and a grinding disc; the silica powder obtained by grinding is sieved into a certain particle size range; the silica powder enters a plasma reaction furnace; vacuumization is carried out; firstly, pre-heating is carried out at lower temperature, then temperature programming is carried out after introducing argon, melting heat preservation is carried out after temperature rising, oxygen is rapidly introduced, and then cooling is rapidly carried out and product powder is collected. The method disclosed by the invention is flexible in process; the prepared silica powder is good in sphericity degree, has a sub-nanometer particle size and is uniform in distribution; product quality reaches the world leading level. 本发明公开了种等离子改进制备亚纳米球形硅微粉的方法,包括硅粉研磨、筛分、预反应、反
Bibliography:Application Number: CN20171525404