Thermoelectric module and manufacturing method thereof

• Main Authors: LEE SEUNG-HYUP, CHOI HYUN-WOO, PARK CHEOL-HEE, KIM DONG-SIK, LIM BYUNG-KYU, LEE DAE-KI, PARK YE-ROK, LEE JAE-KI
• Format: Patent
• Language: Chinese; English
• Published: 13.10.2017
• Subjects: ELECTRICITY

Disclosed is a thermoelectric module which adopts a bonding technology enabling a thermoelectric module to be stably driven even at a high temperature, and a method for manufacturing the same. A thermoelectric module according to the present invention comprises: a plurality of thermoelectric elements each consisting of a thermoelectric semiconductor; an electrode which is made of a metal material and is connected between the thermoelectric elements; and a bonding layer which comprises a metal compound consisting of two or more metals, as a sintered body of a paste, interposed between the thermoelectric element and the electrode, which bonds the thermoelectric element and the electrode and comprises the two or more kinds of metal powders. 本公开内容公开了使用用于在高温下稳定地驱动热电模块的粘结技术的热电模块和制造所述热电模块的方法。根据本公开内容的热电模块包括：包含热电半导体的热电元件、包含金属材料并且连接在热电元件之间的电极、以及粘结层，所述粘结层介于热电元件与电极之间以使热电元件与电极粘结并且包含作为含有两种或更多种金属粉末的糊料的烧结体的含有两种或更多种金属的金属化合物。