Atomic layer deposition apparatus

• Main Authors: ZIJLMANS WIRO RUDOLF, DULLEMEIJER ERNST, LIJSTER GUIDO, BIJKER MARTIN DINANT
• Format: Patent
• Language: Chinese; English
• Published: 26.09.2017
• Subjects: CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

The invention relates to an apparatus (1) for atomic layer deposition comprising a frame (2), an injector head (40) provided with longitudinal slots for respectively supplying gasses to respective deposition spaces (41,42,43,44,45,46,47) confined by the longitudinal slots and a substrate (8), wherein the longitudinal slots are directed transverse to a movement in a first direction (X) of the substrate with respect to the injector head (40),a sub frame (52) arranged to suspend the injector head; a movable carrier (30) arranged to support the substrate (8) for the movement in the first direction (X);and gas pads (53,54,55)at the sub frame (52)outside the injector head (40)between the sub frame (52) and the moveable carrier (30)to bear the sub frame (52) on the carrier (30) for the movement in the first direction (X),wherein the apparatus further comprises actuators (60,61,62) for suspending the injector head (40) from the sub frame (52); and a control device (100) connected to the actuators (60,61,62) and arran