Lead-free solder alloy with low cost and high melting point and preparation method thereof

• Main Authors: GONG JUNWEN, YE YAOHUI
• Format: Patent
• Language: Chinese; English
• Published: 19.09.2017
• Subjects: ALLOYS; CHEMISTRY; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; FERROUS OR NON-FERROUS ALLOYS; MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; METALLURGY; PERFORMING OPERATIONS; SOLDERING OR UNSOLDERING; TRANSPORTING; TREATMENT OF ALLOYS OR NON-FERROUS METALS; WELDING; WORKING BY LASER BEAM

The invention discloses a lead-free solder alloy with low cost and high melting point and a preparation method thereof. The lead-free solder alloy with low cost and high melting point comprises main components, auxiliary components and the balance of Sn; the main components comprise 12-25% of Sb, 0.1-5% of Cu, 0.01-0.5% of Bi, and 0.005-0.20% of Ni; and the auxiliary components comprise 0.0-0.20% of microalloy for improving a microcrystal structure, and 0.00-0.05% of micro antioxidant for resisting oxidation. The lead-free solder alloy with low cost and high melting point reaches a melting point temperature range of 241.5-299.2 DEG C, that is, the melting temperature is above 240 DEG C, and the liquid-phase line temperature reaches 299.2 DEG C; and meanwhile, the alloy contains no harmful substance lead. 种低成本高熔点的无铅焊料合金及其制备方法，其中低成本高熔点的无铅焊料合金包括：主组份、辅助组份以及余量Sn，主组份包括12～25％Sb，0.1～5％Cu，0.01～0.5％Bi，0.005～0.20％Ni，辅助组份包括用于改善微观晶体结构的0.0～0.20％微量合金及用于抗氧化的0.00～0.05％微量抗氧化剂。本发明低成本高熔点的无铅焊料合金熔点温度范围在241.5～299.2℃，即具有超过240℃的融化温度，