Semiconductor module

• Main Authors: TETSUYA INABA, YOSHINARI IKEDA
• Format: Patent
• Language: Chinese; English
• Published: 18.08.2017
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

A semiconductor module includes a plurality of semiconductor chips (400) that include gate electrodes on front surfaces, a gate terminal that receives a control signal from outside, and a print substrate (500). The print substrate (500) includes a gate wiring layer (510) that separates the control signal that is input into the gate terminal and passes the control signal to the gate electrodes of the semiconductor chips (400), and a cross-sectional area of the gate wiring layer (510) becomes larger as the gate wiring layer gets closer to the gate terminal from the gate electrodes. 本发明的半导体模块能够均匀地产生焦耳热，且能够抑制可靠性降低。半导体模块具有：表面上设有栅极电极的多个半导体芯片(400)、输入来自外部的控制信号的栅极端子以及印刷电路板(500)。印刷电路板(500)具有栅极配线层(510)，该栅极配线层(510)将输入栅极端子的控制信号进行分路，并与多个半导体芯片(400)各自的栅极电极导通，并且，栅极配线层(510)的剖面积随着从栅极电极靠近栅极端子而变大。