Substrate arranging method and device, substrate receiving method and device, substrate liquid processing method and device, and substrate processing system

• Main Authors: KEIJI ONZUKA, HIROZUMI HOSHINO
• Format: Patent
• Language: Chinese; English
• Published: 18.08.2017
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The invention provides a substrate arranging method and device, substrate receiving method and device, substrate liquid processing method and device, and substrate processing system. Even if the substrate is warped (deformed), the substrates are prevented from coming into contact with the substrate support, and the substrates themselves. In the present invention, the substrate support (39) can be moved from a position different from the locally upturned positions (A, C) and the downturned positions (B, D) along the outer peripheral end of the substrates (8) toward the central portion of the substrates (8). The present invention can be applied to a substrate arranging method (substrate arranging device) for arranging one or more substrates (8), a substrate receiving method (substrate receiving device) for receiving the substrates (8) using a substrate support (39), a substrate liquid treatment method (substrate liquid processing apparatus) for processing a plurality of substrates (8) together, and a substrate