Liquid Ejection Head, Liquid Ejection Apparatus, And Manufacturing Method

A liquid ejection head capable of suppressing a change in pressure of a pressure chamber, a liquid ejection apparatus, and a manufacturing method are provided. For that reason, a lid member is formed on a wafer-shaped element board and the element board is cut into chips to manufacture a print eleme...

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Main Authors MORI TATSUROU, ISHIKAWA TETSUSHI, AOKI TAKATSUNA, SATO TAMAKI, TOMINAGA YASUAKI, OTSUKA MANABU, YAMAMOTO AKIRA, IWANAGA SHUZO, KARITA SEIICHIRO, TAMENAGA ZENTARO, NAGAI NORIYASU, YAMADA KAZUHIRO, SAITO AKIO, OKUSHIMA SHINGO
Format Patent
LanguageChinese
English
Published 11.08.2017
Subjects
CORRECTION OF TYPOGRAPHICAL ERRORS
i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME
LINING MACHINES
PERFORMING OPERATIONS
PRINTING
SELECTIVE PRINTING MECHANISMS
STAMPS
TRANSPORTING
TYPEWRITERS
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Summary:A liquid ejection head capable of suppressing a change in pressure of a pressure chamber, a liquid ejection apparatus, and a manufacturing method are provided. For that reason, a lid member is formed on a wafer-shaped element board and the element board is cut into chips to manufacture a print element board. 提供种能够抑制压力室的压力变化的液体喷出头、液体喷出设备及制造方法。因此，在晶圆状的元件基板上形成盖构件，将该元件基板切割成芯片以制造打印元件基板。
Bibliography:Application Number: CN201710014595