Thermal management in the field of e-mobility
The invention relates to a ceramic cooling and heating body (1) for controlling the temperature of components, wherein the cooling and heating body (1) consists of a plate-shaped support with a front side (2), an opposite rear side and side faces (3) connecting the front side (2) to the rear side, a...
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Main Author | |
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Format | Patent |
Language | Chinese English |
Published |
01.08.2017
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Subjects | |
Online Access | Get full text |
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Summary: | The invention relates to a ceramic cooling and heating body (1) for controlling the temperature of components, wherein the cooling and heating body (1) consists of a plate-shaped support with a front side (2), an opposite rear side and side faces (3) connecting the front side (2) to the rear side, and metallizations, connected to the support, are arranged on the front side (2) and/or the rear side, and the support has cooling elements. In order to be able to control the temperature of any electrical or electronic component, it is proposed according to the invention that a heating structure (4) is affixed to the front side (2) and/or the rear side.
本发明涉及种用于调节构件的温度的陶瓷的冷却和加热体(1),其中冷却和加热体(1)包括带有前侧(2)、相对而置的后侧以及将前侧(2)与后侧连接的侧面(3)的板形的支承体并且在前侧(2)和/或后侧上布置有与支承体连接的金属施敷物并且支承体具有冷却元件。为了能够调节任意的电气的或电子的构件的温度,根据本发明提出了,在前侧(2)和/或后侧上施加有加热结构(4)。 |
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Bibliography: | Application Number: CN201580063635 |