Circuit board production method of different plate-material mixed compression

• Main Author: MO JIEYUN
• Format: Patent
• Language: Chinese; English
• Published: 28.07.2017
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

The invention discloses a circuit board production method of different plate-material mixed compression. The method comprises the following steps of carrying out browning plate pressing on different plate materials with lines so as to form a mixed-compression plate; successively carrying out drilling, plate baking and plasma degumming on the mixed-compression plate; and carrying out electroless plating copper plate electricity, outer-layer dry film, pattern plating, etching and other subsequent operations on the degummed mixed-compression plate. In the invention, during drilling, an LE aluminum sheet is additionally used to separate and drilling is sectionally performed in a row mode and a column mode at intervals so that interval time of two adjacent drillings is increased, and drilling quality and a drill bit service life are improved and prolonged. A circuit board produced in the invention is not easy to be a blasting plate and is not easy to generate a crack defect. In the invention, degumming is performe