Printed circuit board and semiconductor package including the printed circuit board

• Main Authors: KIM DONG-SUK, LEE SHLE-GE, KIM YU-DUK, CHO KYONG-SOON
• Format: Patent
• Language: Chinese; English
• Published: 25.07.2017
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

The disclosure provides a printed circuit board and a semiconductor package including the printed circuit board. A printed circuit board (PCB) reducing a thickness of a semiconductor package and improving reliability of the semiconductor package, a semiconductor package including the PCB, and a method of manufacturing the PCB may be provided. The PCB may include a substrate base having at least one base layer, and a plurality of wiring layers disposed on a top surface and a bottom surface of the at least one base layer, the plurality of wiring layers defining a plurality of wiring patterns, respectively may be provided. An elastic modulus of a conductive material of one wiring pattern of at least one wiring layer from among the plurality of wiring layers may be less than a conductive material of another wiring pattern. 本公开提供印刷电路板以及包括该印刷电路板的半导体封装。可以提供种减小半导体封装的厚度并改善半导体封装的可靠性的印刷电路板(PCB)、包括该PCB的半导体封装以及制造该PCB的方法。PCB可以包括具有至少个基底层的基板基底以及设置在至少个基底层的顶表面和底表面上的多个配线层，可以提供分别限定多个配线图案的多个配线层。多个配线层当中的至少个配线层的个配线图案的导电材料的弹性模量可以小于另