Constituent for polyimide film manufacture, its manufacturing method, and manufacturing method of polyimide film using it

• Main Authors: LEE SEUNG KI, BYUN JA HUN, LEE SONG CHUN, CHA YENG CHOL, PARK SEONG YUN, KIM TONG IM, ANN MIN SUK, HONG WU SEONG, BAE MIN YONG, PARK SE JOO, CHEONG CHAE HEUN, RYANG KEE SOK
• Format: Patent
• Language: Chinese; English
• Published: 14.07.2017
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; GENERAL PROCESSES OF COMPOUNDING; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; WORKING-UP

The invention relates to a polyimide precursor, its manufacturing method, and a manufacturing method of a polyimide film using the polyimide precursor. 本发明涉及聚酰亚胺前驱体及其制备方法以及利用该聚酰亚胺前驱体的聚酰亚胺薄膜的制备方法。