Chemical mechanical polishing liquid and application thereof

• Main Authors: JING JIANFEN, CAI XINYUAN, YANG JUNYA, QIU TENGFEI, YAO YING
• Format: Patent
• Language: Chinese; English
• Published: 07.07.2017
• Subjects: ADHESIVES; BASIC ELECTRIC ELEMENTS; CHEMISTRY; DYES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; PAINTS; POLISHES; POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH; SEMICONDUCTOR DEVICES; SKI WAXES

The invention a high-concentration chemical mechanical polishing liquid and application thereof; the high-concentration chemical mechanical polishing liquid comprises abrasive particles (a), amino silane coupling agent (b), an imidazole compound (c), a complexing agent (d), organic phosphoric acid (e), an oxidant (f) and water (g). The high-concentration chemical mechanical polishing liquid is used for TSV (through-silicon-via) and IC (integrated circuit) barrier layer polishing and may meet the requirements on polishing rates and selection ratios of various materials; the liquid has great corrective powder for the surface of a silicon wafer device, can provide quick flattening and can prevent local or whole corrosion occurred during metal polishing, operating efficiency is improved, and production cost is lowered. 本发明公开了种高浓缩的化学机械抛光液及其应用，该抛光液包含：(a)研磨颗粒(b)氨基硅烷偶联剂(c)唑类化合物(d)络合剂(e)有机磷酸(f)氧化剂(g)水。本发明的化学机械抛光液用于TSV和IC阻挡层抛光，可以满足各种材料的抛光速率和选择比要求；该抛光液对硅片器件表面有很强的矫正能力，能实现快速平坦化，且可防止金属抛光过程中产生的局部和整体腐蚀，提高工作效率，降低生产成本。