Packing contained polytetrafluoroethylene composite material, sheet and circuit board containing same

• Main Authors: MENG YUNDONG, SU MINSHE, JIANG ENWEI, YANG ZHONGQIANG
• Format: Patent
• Language: Chinese; English
• Published: 07.07.2017
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL PROCESSES OF COMPOUNDING; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; WORKING-UP

The invention belongs to the technical field of circuit boards and relates to a packing contained polytetrafluoroethylene composite material, a sheet and a circuit board. The packing contained polyarylether or polyaryl sulfide composite material includes a three-dimensional net-structure material and packing spread in pores of the three-dimensional net-structure material, and the three-dimensional net-structure material is mainly formed by mutual lapping or adhering polytetrafluoroethylene fibers. By the arrangement of the packing contained composite material, the sheet and the circuit board which are obtained are isotropic in X and Y directions in dielectric constant, low in the dielectric constant and dielectric loss and good mechanical performance. 本发明属于电路基板技术领域，涉及种含填料的聚四氟乙烯复合材料、片材以及电路基板。所述含填料的聚四氟乙烯复合材料包括立体网状结构材料以及分散在立体网状结构材料孔隙中的填料，其中，所述立体网状结构材料主要由聚四氟乙烯纤维相互搭接或粘结而成。该含填料的聚四氟乙烯复合材料赋予采用其得到的片材以及电路基板具有介电常数在X、Y方向各向同性以及低的介电常数和介电损耗和优异的力学性能。