Apparatus And Method For Stripping Solder Metals During The Recycling Of Waste Electrical And Electronic Equipment

• Main Authors: JIANG PING, CHEN TIANNIU, KORZENSKI MICHAEL B
• Format: Patent
• Language: Chinese; English
• Published: 04.07.2017
• Subjects: APPARATUS THEREFOR; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; DISPOSAL OF SOLID WASTE; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; PERFORMING OPERATIONS; PRINTED CIRCUITS; PROCESSES FOR THE ELECTROLYTIC PRODUCTION, RECOVERY ORREFINING OF METALS; RECLAMATION OF CONTAMINED SOIL SOIL; TRANSPORTING

The present invention relates to an apparatus and method for stripping solder metals during the recycling of waste electrical and electronic equipment, and provides apparatuses and processes for recycling printed wire boards, wherein electronic components, precious metals and base metals may be collected for reuse and recycling. The apparatuses generally include a mechanical solder removal module and/or a thermal module, a chemical solder removal module, and a precious metal leaching module, wherein the modules are attached for continuous passage of the e-waste from module to module. 本发明涉及用于在废弃的电气和电子设备的循环利用期间剥离焊料金属的装置和方法。本发明提供的用于循环利用印刷线路板的装置和方法可以收集电子部件、贵金属和贱金属以供重新使用和循环利用。所述装置总的来说包括机械焊料去除模块和/或热模块、化学焊料去除模块和贵金属浸沥模块，其中所述模块连接在起以使电子废弃物从模块到模块连续通过。