Multichip frame packaging structure with heat radiation and manufacturing method thereof

• Main Author: XIE YELEI
• Format: Patent
• Language: Chinese; English
• Published: 27.06.2017
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The invention discloses a multichip frame packaging structure with heat radiation and a manufacturing method thereof. The packaging structure comprises at least one electric conduction pad, a thermal conduction pad, at least two bottom semiconductor chips and a metal heat radiator, wherein the electric conduction pad is used for providing an electric connection path between a chip pin and a packaging body outer pin; the at least two bottom semiconductor chips are placed above the thermal conduction pad; and the metal heat radiator is arranged above the top semiconductor chip and is used for providing a heat radiation channel for the below semiconductor chips. 本发明公开了种散热的多芯片框架封装结构及其制备方法，所述封装结构包括：至少个导电焊盘，所述导电焊盘用于提供芯片管脚与封装体外部管脚的电性连接路径；导热焊盘；放置在所述导热焊盘上方的至少两个底层半导体芯片；设置在最上层半导体芯片上方的金属散热器，所述金属散热器用于为下方的半导体芯片提供散热通道。