Socket contact techniques and configurations

• Main Authors: CANNY SARAH M, AYGUN KEMAL, GORDON GLEN P, CHAWLA GAURAV, NEKKANTY SRIKANT, ATHREYA DHANYA, SMALLEY JEFFORY L, GARCIA MICHAEL, HEPPNER JOSHUA D
• Format: Patent
• Language: Chinese; English
• Published: 31.05.2017
• Subjects: BASIC ELECTRIC ELEMENTS; CURRENT COLLECTORS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; LINE CONNECTORS; SEMICONDUCTOR DEVICES

Embodiments of the present disclosure are directed towards socket contact techniques and configurations. In one embodiment, an apparatus may include a socket substrate having a first side and a second side disposed opposite to the first side, an opening formed through the socket substrate, an electrical contact disposed in the opening and configured to route electrical signals between the first side and the second side of the socket substrate, the electrical contact having a cantilever portion that extends beyond the first side, wherein the first side and surfaces of the socket substrate in the opening are plated with a metal. Other embodiments may be described and/or claimed. 本公开内容的实施例涉及插口接触部技术和构造。在个实施例中，种装置可以包括：具有第侧以及被设置为与第侧相对的第二侧的插口基板、被形成为穿过插口基板的开口、被设置在开口中并被配置为在插口基板的第侧与第二侧之间传送电信号的电接触部，该电接触部具有延伸超出第侧的悬臂部分，其中，第侧和插口基板的在开口中的表面用金属进行电镀。可以描述和/或要求保护其它实施例。