CURABLE RESIN COMPOSITION, CURED PRODUCT, SEALING MEMBER SEMICONDUCTOR DEVICE

• Main Authors: KAMURO SHIGEAKI, NAKAGAWA YASUNOBU
• Format: Patent
• Language: Chinese; English
• Published: 31.05.2017
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; SEMICONDUCTOR DEVICES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

Provided is a curable resin composition capable of forming a cured product that has excellent heat resistance and transparency and, in particular, offers excellent barrier properties to a corrosive gas. The curable resin composition according to the present invention includes a polyorganosiloxane (A), an isocyanurate compound (B), and a silane coupling agent (C). The polyorganosiloxane (A) is an aryl-containing polyorganosiloxane. The polyorganosiloxane (A) preferably includes a polyorganosiloxane having a number-average molecular weight (Mn) of 500 to 4000 as determined by gel permeation chromatography and calibrated with a polystyrene standard. 本发明的目的在于提供种固化性树脂组合物，其能够形成具有优异的耐热性、透明性、特别是对腐蚀性气体的阻隔性优异的固化物。本发明的固化性树脂组合物包含聚有机硅氧烷(A)、异氰脲酸酯化合物(B)及硅烷偶联剂(C)，聚有机硅氧烷(A)为具有芳基的聚有机硅氧烷。聚有机硅氧烷(A)优选为基于凝胶渗透色谱法的标准聚苯乙烯换算的数均分子量(Mn)为500～4000的聚有机硅氧烷。