CMP slurry composition for organic film and polishing method using same
The present invention relates to a CMP slurry composition, for an organic film, for polishing an organic film and an organic film polishing method using same, the CMP slurry composition comprising: a polar solvent and/or a non-polar solvent; metal oxide abrasives; an oxidant; and a heterocyclic comp...
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Main Authors | , , , , , |
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Format | Patent |
Language | Chinese English |
Published |
17.05.2017
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Subjects | |
Online Access | Get full text |
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