Universal testing device for package type integrated circuit with pins at two edges or four edges

• Main Authors: CHEN JIAFENG, DUAN CHAOYI, JIANG WEI
• Format: Patent
• Language: Chinese; English
• Published: 17.05.2017
• Subjects: MEASURING; MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES; PHYSICS; TESTING

The invention discloses a universal testing device for a package type integrated circuit with pins at two edges or four edges. The universal testing device an upper pushing cover and a base. A single-edge contact module bottom fixing plate is arranged on the base and is provided with a protrusion, a...