Universal testing device for package type integrated circuit with pins at two edges or four edges

• Main Authors: CHEN JIAFENG, DUAN CHAOYI, JIANG WEI
• Format: Patent
• Language: Chinese; English
• Published: 17.05.2017
• Subjects: MEASURING; MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES; PHYSICS; TESTING

The invention discloses a universal testing device for a package type integrated circuit with pins at two edges or four edges. The universal testing device an upper pushing cover and a base. A single-edge contact module bottom fixing plate is arranged on the base and is provided with a protrusion, and two or four integrated circuit single-edge contact modules for being conducted with various package pins of to-be-tested IC (integrated circuits) are fixed to the periphery of the protrusion; a floating plate is further arranged above the protrusion, and a plurality of through holes which are in one-to-one correspondence with the package pins of the to-be-tested IC are formed in the floating plate; the to-be-tested IC can be fixedly arranged on the floating plate, and clips of the four single-edge contact modules for the integrated circuits can respectively penetrate the through holes in the floating plate to be correspondingly connected and conducted with the package pins of the to-be-tested IC. The universal t