Double-sided circuit substrate suitable for high-frequency circuits

Provided is a double-sided circuit substrate being a laminate of: a composite material comprising a fluorine resin and a glass cloth; and a copper foil having a two-dimensional roughness Ra in a mat surface (a surface that comes in contact with the resin) of less than 0.2 [Mu]m. Ideally, a surface o...

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Bibliographic Details
Main Authors MOTEKI SHIGERU, INABA TAKESHI, KOMORI HIROKAZU, AKATUKA YASUMASA
Format Patent
LanguageChinese
English
Published 10.05.2017
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PERFORMING OPERATIONS
PRINTED CIRCUITS
TRANSPORTING
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Summary:Provided is a double-sided circuit substrate being a laminate of: a composite material comprising a fluorine resin and a glass cloth; and a copper foil having a two-dimensional roughness Ra in a mat surface (a surface that comes in contact with the resin) of less than 0.2 [Mu]m. Ideally, a surface of the fluorine resin has an O content of at least 1.0%, as observed using ESCA. 本发明提供种双面电路用基板，其为包含含氟树脂和玻璃布的复合材料与粗糙面(与树脂接触的面)的二维粗糙度Ra小于0.2μm的铜箔的层叠体。在使用ESCA进行观察时，上述含氟树脂的表面的O的存在比例优选为1.0％以上。
Bibliography:Application Number: CN201580042272