Alternative ground lines for inter-slot grounding

• Main Authors: WIN THIDA MA, NG BOON BING, RANDO JOSE JEHROME
• Format: Patent
• Language: Chinese; English
• Published: 10.05.2017
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

In an example implementation, a grounding structure includes a perimeter ground line around the perimeter of a printhead die, and having north, south, east, and west segments. The structure includes an inter-slot ground line extending from the north segment to the south segment between two fluid slots, and an alternative ground line extending from the east segment to the west segment and intersecting the inter-slot ground line in a connection area near ends of the fluid slots. 在范例实施方式中，种接地结构包括周边接地线，所述周边接地线围绕打印头管芯的周边，并且具有北分段、南分段、东分段和西分段。所述结构包括：槽间接地线，其在两个流体槽之间从北分段延伸到南分段；以及备选接地线，其从东分段延伸到西分段，并在接近流体槽的端部的连接区中与槽间接地线相交。