Electronic component

• Main Authors: SAKAMOTO AKIRA, OGURI HIROSHI, TAGUCHI TOMOYA, FUJII YOSHIMARO
• Format: Patent
• Language: Chinese; English
• Published: 10.05.2017
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

An electronic component 1A is provided with: a substrate 10; a layered body 20 comprising a plurality of electroconductive metal material layers 21, 22, 23; and a solder layer 30 comprising an Au-Sn alloy solder. The layered body 20 is disposed on the substrate 10. The solder layer 30 is disposed on the layered body 20. The layered body 20 has a surface layer comprising Au as the electroconductive metal material layer 23 constituting the outermost layer. The surface layer includes a solder-layer-disposed region 23a in which the solder layer 30 is disposed, and a solder-layer-non-disposed region 23b in which the solder layer 30 is not disposed. The solder-layer-disposed region 23a and the solder-layer-non-disposed region 23b are spatially separated. 本发明的电子部件(1A)包含基板(10)、多层导电性金属材料层(21、22、23)的层叠体(20)、由Au-Sn合金焊料构成的焊料层(30)。层叠体(20)配置于基材(10)上。焊料层(30)配置于层叠体(20)上。作为构成最外层的导电性金属材料层(23)，层叠体(20)具有由Au构成的表面层。表面层包含供配置焊料层(30)的焊料层配置区域(23a)、及不配置焊料层(30)的焊料层非配置区域(23b)。焊料层配置区域(23a)与焊料层非配置区域(23b)空间性地隔开。