Composite formulation and electronic component

• Main Authors: HOLM AARON, WANG JIALING, ROBISON JENNIFER L, GAO TING, GOLDEN JOSH H, WARTENBERG MARK F, FRECKMANN DOMINIQUE MARIE M
• Format: Patent
• Language: Chinese; English
• Published: 10.05.2017
• Subjects: BASIC ELECTRIC ELEMENTS; CABLES; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; CONDUCTORS; ELECTRICITY; INSULATORS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

A composite formulation (100) and electrical component are disclosed. The composite formulation includes a polymer matrix (101) having at least 15% crystallinity and process-aid-treated copper-containing particles (103) blended with the polymer matrix including first higher aspect ratio particles (501) and second lower aspect ratio particles (503). The higher ratio particles and the lower ratio particles produce a decreased percolation threshold for the composite formulation when processed by extrusion or molding, the decreased percolation threshold being compared to a similar composition that fails to include the first particles and the second particles. The electrical component includes a composite product (102) produced from the composite formulation and is selected from the group consisting of an antenna (401), electromagnetic interference shielding device (201), a connector (301) housing, and combinations thereof. 公开了复合配制物(100)和电气组件。复合配制物包含具有至少15％结晶度的聚合物基质(101)和与聚合物基质共混的被加工助剂处理过的含铜粒子(103)，其包含第较高长径比的粒子(50