Assembly body for micromirror chips, mirror device and production method for a mirror device

The invention relates to an assembly body (10) for micromirror chips (12a, 12b), which partially encloses an internal cavity (18), wherein the assembly body (10, 40) comprises, on each of two sides (10a, 10b) directed away from one another, at least one partial external wall (20, 22) which is transp...

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Bibliographic Details
Main Authors HEUCK FRIEDJOF, SCHATZ FRANK, PINTER STEFAN, PANTEL DANIEL, DOESSEL KERRIN, ROHLFING FRANZISKA
Format Patent
LanguageChinese
English
Published 10.05.2017
Subjects
MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES
MICROSTRUCTURAL TECHNOLOGY
OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
OPTICS
PERFORMING OPERATIONS
PHYSICS
TRANSPORTING
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Summary:The invention relates to an assembly body (10) for micromirror chips (12a, 12b), which partially encloses an internal cavity (18), wherein the assembly body (10, 40) comprises, on each of two sides (10a, 10b) directed away from one another, at least one partial external wall (20, 22) which is transparent for a predefined spectrum, and wherein the assembly body (10, 40) has at least a first external opening (24a), to which a first micromirror chip (12a) can be fitted, and a second external opening (24b), to which a second micromirror chip (12b) can be fitted, so that a light beam (26) impinging through the first partial external wall (20) can be deflected by means of the first micromirror chip (12a) onto the second micromirror chip (12b) and by means of the second micromirror chip (12b) through the second partial external wall (22). The invention likewise relates to a mirror device. The invention further relates to a production method for a mirror device. 本发明涉及种用于微镜芯片(12a，12b)的装配体(10)，该装配体部分围绕内空腔(18)，其中，所述装配体(
Bibliography:Application Number: CN201580023728