Printed Circuit Board Assembly Having A Damping Layer

The invention discloses a printed circuit board assembly having a damping layer. The printed circuit board (PCB) assembly having several electronic components mounted on a PCB and a damping layer covering the electronic components, is disclosed. Embodiments of the PCB assembly include an overmold la...

Full description

Saved in:
Bibliographic Details
Main Authors CURTIS C. MEAD, ZHONG-QING GONG, BENJAMIN A. BARD, SUNG WOO YOO, KEVI R. RICHARDSON, GEMIN LI, NELSON J. KOTTKE, PAUL MARTINEZ, CONNOR R. DUKE, KIERAN POULAIN
Format Patent
LanguageChinese
English
Published 08.03.2017
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
Online AccessGet full text

Cover

More Information
Summary:The invention discloses a printed circuit board assembly having a damping layer. The printed circuit board (PCB) assembly having several electronic components mounted on a PCB and a damping layer covering the electronic components, is disclosed. Embodiments of the PCB assembly include an overmold layer constraining the damping layer against the PCB. Embodiments of the PCB assembly include an interposer between a capacitor of the electronic components and the PCB. Other embodiments are also described and claimed. 本公开涉及具有阻尼层的印刷电路板组件。公开了种印刷电路板(PCB)组件，该PCB组件具有安装在PCB上的数个电子部件以及覆盖电子部件的阻尼层。PCB组件的实施例包括约束阻尼层抵靠PCB的包覆成型层。PCB组件的实施例包括在电子部件的电容器和PCB之间的插入器。其他实施例也被描述和要求保护。
Bibliography:Application Number: CN201610608381