Antenna feed integrated on multi-layer printed circuit board

The present disclosure relates to a pre-5th-Generation (5G) or 5G communication system to be provided for supporting higher data rates Beyond 4th-Generation (4G) communication system such as Long Term Evolution (LTE). A transmitter includes apparatus for integrating the antenna feed into a multilaye...

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Bibliographic Details
Main Authors MONROE ROBERT, TZANIDIS IOANNIS
Format Patent
LanguageChinese
English
Published 01.03.2017
Subjects
ANTENNAS, i.e. RADIO AERIALS
BASIC ELECTRIC ELEMENTS
ELECTRICITY
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Summary:The present disclosure relates to a pre-5th-Generation (5G) or 5G communication system to be provided for supporting higher data rates Beyond 4th-Generation (4G) communication system such as Long Term Evolution (LTE). A transmitter includes apparatus for integrating the antenna feed into a multilayer PCB. The apparatus includes an antenna element disposed over the multilayer PCB having slot openings that substantially overlap and that enable an RF signal to be coupled from a printed transmission line located on one of the multilayer PCB conductive layers. The multilayer PCB board hosts at least one transceiver unit and a baseband unit such that the antenna feed, transceiver and baseband units are integrated on a single multilayer PCB board without degradation of antenna bandwidth and efficiency. 本公开涉及为支持更高的数据速率而提供的预第五代(5G)或5G通信系统，超第四代(4G)通信系统，第四代(4G)通信系统诸如长期演进LTE。发射机包括用于将天线馈电器集成到多层印刷电路板(PCB)中的设备。本设备包括布置在具有缝隙开口的多层PCB之上的天线元件，缝隙开口基本上互相重叠并且使得RF信号能够从位于多层PCB导电层中的个上的印刷传输线耦合。多层PCB板包括至少个收发器单元和基带单元，使得在不降低天线带宽和效率的情况下将天线
Bibliography:Application Number: CN201580035709