CARRIER TAPE, METHOD FOR MANUFACTURING SAME, AND METHOD FOR MANUFACTURING RFID TAG

A method for manufacturing a carrier tape according to the present invention comprises manufacturing a carrier tape for accommodating a plurality of electronic components fitted with a sealing material, wherein the method includes: a step for preparing a tape-shaped body that has a plurality of bott...

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Bibliographic Details
Main Authors KOMAKI KUNIHIRO, KATO NOBORU
Format Patent
LanguageChinese
English
Published 01.03.2017
Subjects
CALCULATING
COMPUTING
COUNTING
HANDLING RECORD CARRIERS
PHYSICS
PRESENTATION OF DATA
RECOGNITION OF DATA
RECORD CARRIERS
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Summary:A method for manufacturing a carrier tape according to the present invention comprises manufacturing a carrier tape for accommodating a plurality of electronic components fitted with a sealing material, wherein the method includes: a step for preparing a tape-shaped body that has a plurality of bottomed accommodation holes along the longitudinal direction; a step for accommodating a chip electronic component in each of the plurality of accommodation holes; a step for pasting a tape-shaped sealing material that has an adhesive layer on one principal surface to the tape-shaped body in such a way that the adhesive layer covers the accommodation holes and adheres to the electronic component; and a step for forming a notch in the tape-shaped sealing material so that a portion of the sealing material including a portion that overlaps at least a portion of each of the accommodation holes in plan view is separated from the other portions. 本发明所涉及的载带的制造方法，是收纳多个附带密封材料的电子元器件的载带的制造方法，包含：准备沿长度方向具有多个有底的收纳孔的带状本体的工序；分别将芯片状的电子
Bibliography:Application Number: CN2016800952