Method for producing bonded body

Disclosed is a bonded body production method for producing a bonded body having a structure in which a substrate and an electronic component are bonded by means of a metal particle paste, the method comprising: an assembly forming step for forming an assembly in which an electronic component is plac...

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Bibliographic Details
Main Authors MORINAGA YUJI, MATSUBAYASHI RYO
Format Patent
LanguageChinese
English
Published 22.02.2017
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:Disclosed is a bonded body production method for producing a bonded body having a structure in which a substrate and an electronic component are bonded by means of a metal particle paste, the method comprising: an assembly forming step for forming an assembly in which an electronic component is placed on a substrate with a metal particle paste therebetween; an assembly arranging step for arranging the assembly between two heating plates; and a bonding step for bonding the substrate and the electronic component together by heating the assembly while pressurizing the same by moving at least one of the two heating plates toward the other. In this bonded body production method, the bonding step is performed under a condition where the temperature of the assembly at the time of starting the pressurization of the assembly with the two heating plates is within the range of from 0 DEG C to 150 DEG C. According to this bonded body production method, because the bonding step is performed under a condition where the tem
Bibliography:Application Number: CN201580031872