Light pipe structure window for low pressure thermal processes

• Main Authors: YE ZHIYUAN, HUNTER AARON MUIR, LO KIN PONG, BRILLHART PAUL, CHANG ANZHONG, TONG EDRIC, MACK JAMES FRANCIS, SANCHEZ ERROL ANTONIO C, RANISH JOSEPH M
• Format: Patent
• Language: Chinese; English
• Published: 22.02.2017
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

Embodiments disclosed herein relate to a light pipe structure for thermal processing of semiconductor substrates. In one embodiment, a light pipe window structure for use in a thermal process chamber includes a transparent plate, and a plurality of light pipe structures formed in a transparent material that is coupled to the transparent plate, each of the plurality of light pipe structures comprising a reflective surface and having a longitudinal axis disposed in a substantially perpendicular relation to a plane of the transparent plate. 本发明公开的实施方式涉及用于半导体基板的热处理的光导管结构。在个实施方式中，用于热处理腔室的光导管窗结构包括透明板及多个光导管结构，多个光导管结构以与透明板耦接的透明材料形成，多个光导管结构的各个包含反射表面且具有纵轴，该纵轴以与透明板的平面有实质垂直关系的方式设置。