Apparatus and method for optical waveguide edge coupler for photonic integrated chips

• Main Authors: JIANG JIA, GOODWILL DOMINIC JOHN, BERNIER ERIC
• Format: Patent
• Language: Chinese; English
• Published: 22.02.2017
• Subjects: OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS; OPTICS; PHYSICS

Embodiments are provided for photonic chip waveguides with improved coupling efficiency to optical fibers. In an embodiment, a photonic chip comprises a semiconductor substrate, a dielectric layer on the substrate, and a tapered silicon or semiconductor waveguide embedded in the dielectric layer. The dielectric layer has lower optical refractive index than the tapered waveguide and serves as a cladding for the tapered waveguide. The chip further includes, on the substrate, a dielectric waveguide adjacent to the dielectric layer. The tip of the tapered waveguide is embedded in the dielectric waveguide. The dielectric waveguide serves to couple the tapered waveguide to an optical fiber, enlarge and better confine the light propagation mode from the taper waveguide to the fiber. 实施例提供的光子芯片波导具有改善的到光纤的耦合效率。在实施例中，光子芯片包括：半导体基板；所述基板上的介电层；嵌入所述介电层的锥形硅或半导体波导。所述介电层具有比所述锥形波导低的光学折射率，并且用作所述锥形波导的包层。所述芯片还包括：所述基板上与所述介电层相邻的介电波导。所述锥形波导的尖部嵌入所述介电波导中。所述介电波导的作用是将所述锥形波导与光纤耦合，放大并更好地限制从所述锥形波导到所述光纤的光传播模式。