Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of alpha amino acids and bisepoxides

Electroplating methods enable the plating of photoresist defined features which have substantially uniform morphology. The electroplating methods include copper electroplating baths with reaction products of alpha-amino acids and bisepoxides to electroplate the photoresist defined features. Such fea...

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Bibliographic Details
Main Authors REDDINGTON ERIK, QIN YI, THORSETH MATTHEW, DZIEWISZEK JOANNA, NIAZIMBETOVA ZUHRA, WOERTINK JULIA, LEFEBVRE MARK
Format Patent
LanguageChinese
English
Published 22.02.2017
Subjects
APPARATUS THEREFOR
CHEMISTRY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
METALLURGY
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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Summary:Electroplating methods enable the plating of photoresist defined features which have substantially uniform morphology. The electroplating methods include copper electroplating baths with reaction products of alpha-amino acids and bisepoxides to electroplate the photoresist defined features. Such features include pillars, bond pads and line space features. 电镀方法能够镀覆具有基本上均匀形态的光致抗蚀剂限定的特征。所述电镀方法包括具有α-氨基酸和双环氧化物的反应产物的铜电镀浴以电镀所述光致抗蚀剂限定的特征。此类特征包括柱、接合垫和线空间特征。
Bibliography:Application Number: CN201610619284