Ag alloy sputtering target and Ag alloy film manufacturing method
Provided is a Ag alloy sputtering target characterized in having a composition containing one or more elements selected from Cu, Sn, Sb, Mg, In and Ti with the total being in the range of 0.1 atom% to 15.0 atom% and also containing S in the range of 0.5 atom ppm to 200 atom ppm, the balance being ob...
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Main Authors | , , |
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Format | Patent |
Language | Chinese English |
Published |
15.02.2017
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Subjects | |
Online Access | Get full text |
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