Method for preparing copper film through controlled atmosphere cold spraying
The invention discloses a method for preparing a copper film through controlled atmosphere cold spraying. The method comprises the steps that firstly, original copper powder is conveyed into a powder oxygen content control unit, copper oxide on the surfaces of copper powder particles is reduced into...
Saved in:
Main Authors | , , , , |
---|---|
Format | Patent |
Language | Chinese English |
Published |
01.02.2017
|
Subjects | |
Online Access | Get full text |
Cover
Loading…
Summary: | The invention discloses a method for preparing a copper film through controlled atmosphere cold spraying. The method comprises the steps that firstly, original copper powder is conveyed into a powder oxygen content control unit, copper oxide on the surfaces of copper powder particles is reduced into copper, and the oxygen content of the copper powder is reduced; secondly, the copper powder treated through the powder oxygen content control unit is conveyed into a powder granularity control and powder feeding unit, the input copper powder is scattered and screened, and the granularity of the output copper powder particles is controlled within the set range; thirdly, the copper powder treated in the second step is conveyed into a cold spraying nozzle in a controlled oxygen partial pressure cavity; and fourthly, the speed and temperature of the copper powder particles are regulated and controlled through a gas pressure, flow and temperature control unit, and the copper powder particles in the controlled oxygen pa |
---|---|
Bibliography: | Application Number: CN201610864919 |