Semiconductor device and manufacturing method thereof
The invention discloses a semiconductor device and a manufacturing method thereof. The manufacturing method can comprise the steps of patterning an array and a peripheral region according to a self-aligning quadruple patterning step, and providing a semiconductor device manufactured by combining the...
Saved in:
Main Authors | , , |
---|---|
Format | Patent |
Language | Chinese English |
Published |
18.01.2017
|
Subjects | |
Online Access | Get full text |
Cover
Loading…
Summary: | The invention discloses a semiconductor device and a manufacturing method thereof. The manufacturing method can comprise the steps of patterning an array and a peripheral region according to a self-aligning quadruple patterning step, and providing a semiconductor device manufactured by combining the patterning step.
本发明公开了种半导体装置及其制造方法。方法可包括以自对准四重图案化步骤图案化阵列和周边区、并提供以此结合的图案化步骤制作而成的半导体装置。 |
---|---|
Bibliography: | Application Number: CN201510393301 |