Systems And Methods To Dispense And Mix Reagents

• Main Authors: MCGALL GLENN, LI BOLAN, CRNOGORAC FILIP
• Format: Patent
• Language: Chinese; English
• Published: 18.01.2017
• Subjects: APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL; APPARATUS SPECIALLY ADAPTED THEREFOR; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL; CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOIDCHEMISTRY; CHEMISTRY; CINEMATOGRAPHY; COMBINATORIAL CHEMISTRY; ELECTROGRAPHY; HOLOGRAPHY; INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES; LIBRARIES, e.g. CHEMICAL LIBRARIES, IN SILICOLIBRARIES; MATERIALS THEREFOR; MEASURING; METALLURGY; ORIGINALS THEREFOR; PERFORMING OPERATIONS; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL; PHYSICS; PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL; SPRAYING OR ATOMISING IN GENERAL; TESTING; THEIR RELEVANT APPARATUS; TRANSPORTING

The present disclosure provides methods, device, and system for wafer processing. The wafer processing apparatus uses lid dispenser to disperse at least one reagent to the surface of the wafer. Further, the wafer is positioned on top of a rotatable vacuum chuck configured to spread at least one reagent over the surface of the wafer via a centrifugal force or surface tension, thereby permitting the at least one reagent to react with an additional reagent. Further, when dispensing the at least one reagent, a separation gap between the lid dispenser and the wafer is at a predetermined distance, for example, from 50 mu m to 2 mm. 本公开提供了用于晶片加工的方法、装置和系统。所述晶片加工设备使用封盖分配器将至少种试剂分散到所述晶片的表面。另外，所述晶片安置在可旋转真空吸盘的顶部，所述可旋转真空吸盘被配置成经由离心力或表面张力在所述晶片的所述表面上涂覆至少种试剂，从而允许所述至少种试剂与另外的试剂反应。另外，当分配所述至少种试剂时，所述封盖分配器和所述晶片之间的分隔间隙处于预定距离，例如，50μm至2mm。