Microwave copper-clad plate preparation method capable of keeping low thermal expansion coefficient in three axes at the same time

• Main Authors: SUN XIAOWEI, WANG LU, ZOU JIAJIA, ZHAO DAN, HUANG ZHAO, CHENG MINGSHENG, ZHU CHUNLIN
• Format: Patent
• Language: Chinese; English
• Published: 11.01.2017
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; DYES; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; PERFORMING OPERATIONS; POLISHES; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; USE OF MATERIALS AS ADHESIVES

The invention discloses a microwave copper-clad plate preparation method capable of keeping a low thermal expansion coefficient in three axes at the same time. By means of the method, a low thermal expansion coefficient of a dielectric plate can be kept in the X axis, the Y axis and the Z axis at the same time. The method includes the following steps that 1, bonding sheets are prepared, wherein fluororesin is added into PTFE emulsion for modification, and mixed ceramic powder/particles, reinforced fibers and a surface modifier are added; then the mixture is diluted into several parts of bonding sheet solutions with different concentrations with deionized water, and the bonding sheet solutions are stirred to be uniform; PTFE porous films are dipped into the uniform bonding sheet solutions with different concentrations, and dipping sheets are adjusted to have a preset thickness; moisture and low-temperature volatile matter on the dipped porous films are removed, drying is carried out to achieve film formation o