Microwave copper-clad plate preparation method capable of keeping low thermal expansion coefficient in three axes at the same time
The invention discloses a microwave copper-clad plate preparation method capable of keeping a low thermal expansion coefficient in three axes at the same time. By means of the method, a low thermal expansion coefficient of a dielectric plate can be kept in the X axis, the Y axis and the Z axis at th...
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Main Authors | , , , , , , |
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Format | Patent |
Language | Chinese English |
Published |
11.01.2017
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Subjects | |
Online Access | Get full text |
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Summary: | The invention discloses a microwave copper-clad plate preparation method capable of keeping a low thermal expansion coefficient in three axes at the same time. By means of the method, a low thermal expansion coefficient of a dielectric plate can be kept in the X axis, the Y axis and the Z axis at the same time. The method includes the following steps that 1, bonding sheets are prepared, wherein fluororesin is added into PTFE emulsion for modification, and mixed ceramic powder/particles, reinforced fibers and a surface modifier are added; then the mixture is diluted into several parts of bonding sheet solutions with different concentrations with deionized water, and the bonding sheet solutions are stirred to be uniform; PTFE porous films are dipped into the uniform bonding sheet solutions with different concentrations, and dipping sheets are adjusted to have a preset thickness; moisture and low-temperature volatile matter on the dipped porous films are removed, drying is carried out to achieve film formation o |
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Bibliography: | Application Number: CN20161676514 |