LED flip chip package substrate and LED package structure

• Main Authors: HONG MENGYUAN, QIN GUOHENG
• Format: Patent
• Language: Chinese; English
• Published: 04.01.2017
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The invention relates to an LED flip chip package substrate, and the substrate comprises a ceramic substrate (for example, an aluminium nitride substrate); a conductor wire layer which is disposed on the ceramic substrate and comprises bonding pads arranged in a paired manner; an insulating protection layer (for example, a low-temperature glass glaze layer) which is disposed at the same side of the ceramic substrate as the conductor wire layer, and enables the bonding pads to be exposed; and a metal reflection layer (for example, a metal aluminum layer) which is disposed at one side, far from the ceramic substrate, of the insulating protection layer, and enables the bonding pads to be exposed. In addition, the invention also proposes an LED package structure which employs the LED flip chip package substrate, and other LED package structures with similar material layers, such as the chip-level package LED package structure. Accordingly, the advantages of various types of materials are used comprehensively, and